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Home > ESD Protection Devices > Multi Layer Varistors

Raychem Multi Layer Varistors

Multi Layer Varistors are small, leadless, surface mount packages made of multiple layers of Zinc Oxide, with electrodes between them. They are used to help protect integrated circuits and other sensitive equipment. Their small size is ideal for high density printed circuit boards.

Tyco Electronics Circuit Protection also offers the “E” series which is a family of low capacitance MLVs. They are specifically designed to provide ESD protection in high data rate applications.

 ESD Protection Devices
 
Standard Series Varistor Voltage Maximum Working Voltage Clamping Voltage Peak Current Max Transient Energy Typical Capacitance †
Symbol Vv V RMS V DC Vc I max W max Cp
Units V V V (Max) V A (Min) J (Max) pF
Test Conditions @ 1mA DC <10μA <10μA @ 1A 8/20μs 8/20μs 10/1000μs @ 1MHz
MLV0402-080M-C221 8 ± 20% 4 5.5 20 20 0.05 220
MLV0402-250K-C400 25 ± 10% 14 18 50 20 0.05 40
MLV0603-130M-C201 13.5 ± 20 % 7 9 30 30 0.1 200
MLV1206-700K 70 ± 10 % 40* 56* 120 200 1 180
* Test Conditions < 50μA
† Cp - Device capacitance measured with zero volt bias and 1Vrms signal.

 

"E" Series Maximum Working Voltage Typical Clamping Voltage ‡ Leakage Current Typical Capacitance
Symbol V DC Vc I L Cp
Units V (Max) V μ A (Max) pF
Test Conditions < 10μA IEC Pulse @12V @ 1MHz
MLV0402-180-E030 18 350 <1 3
MLV0402-120-E120 12 100 <1 12
‡ Measure per IEC61000-4-2, 8kV contact discharge, 30 ns after initiation of the ESD pulse.

All ROV parts are RoHS Compliant

Part Numbering System for Multi Layer Varistors

 
  • Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.
  • The devices are intended for protection against occasional overvoltage fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.
  • Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.