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PolyZen Devices - Polymer Protected, Precision Zener Diodes

The PolyZen device is a thermally protected, precision Zener diode that helps protect circuits from overvoltage & overcurrent fault conditions.
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Part Number	V_Z (V) Typical	I_ZT (A)	I_HOLD @ 20ºC (A)	R Typ (Ohms)	R_1MAX (Ohms)	V_INT Max @ 3A (V)	I_FLT Max (A)	Power Dissipation (W)
ZEN056V130A24LS	5.6	0.1	1.30	0.12	0.16	24	+10 / -40	0.7
ZEN132V130A24LS	13.4	0.1	1.30	0.12	0.16	24	+3 / -40	0.7
ZEN056V230A16LS NEW	5.6	0.1	2.30	0.04	0.06	16	+5 / -40	0.7
ZEN065V230A16LS NEW	6.5	0.1	2.30	0.04	0.06	16	+3.5 / -40	0.7
ZEN164V130A24LS NEW	16.4	0.1	1.30	0.12	0.16	24	+1.25 / -40	0.7
ZEN065V130A24LS Coming Soon	6.5	0.1	1.30	0.12	0.16	24	TBD / -40	0.7
ZEN132V230A16LS Coming Soon	13.2	0.1	2.30	0.04	0.06	16	TBD / -41	0.7

All parts RoHS compliant

Application Notes

**NEW** Automotive Infotainment Peripherals (pdf 111KB)
**NEW** Portable Media Player Protection (pdf 109KB)
Portable electronics (pdf 359KB)
USB port protection (pdf 408KB)

**Part Numbering System for PolyZen Devices**

Definitions
V_Z	Voltage out
I_ZT	Current at which V_Z is measured
I_HOLD	Maximum steady state I_PTC that will not generate a trip event at the specified temperature. Specification assumes I_FLT is sufficiently low so as to prevent the diode from acting as a heat source.
R Typ	Resistance between V_IN and V_OUT pins during normal operation at room temperature
R_1MAX	The maximum resistance between V_IN and V_OUT pins during normal operation at room temperature, one hour after first trip or after reflow soldering
I_FLT	Current flowing through the Zener diode
I_FLT Max	Maximum RMS fault current the diode portion of the device can withstand and remain resettable; testing is conducted at ±24V and -16V with no load connected to V_OUT
V_INT Max	The voltage at which typical devices (98% devices , 95% confidence) survived at least 100 trip cycles and 24 hours trip endurance at the specified voltage and current (I_PTC)

Recommended reflow methods:

Hot air
Nitrogen

Recommendations:

Devices can be cleaned using standard methods and aqueous solvents.
Tyco Electronics believes that the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed underneath each solder pad. As such, Tyco Electronics requests that customers comply with our recommended solder pad layouts.
Tyco Electronics requests that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch devices. It is possible that raised features could negatively impact solderability performance of our devices.

All information, including illustrations, is believed to be reliable. Users, however, should independently evaluate the suitability of each product for their application. Tyco Electronics Corporation makes no warranties as to the accuracy or completeness of the information, and disclaims any liability regarding its use. Tyco Electronics’ only obligations are those in the Company’s Standard Terms and Conditions of Sale for this product, and in no case will Tyco Electronics be liable for any incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of the product. Specifications are subject to change without notice. In addition, Tyco Electronics reserves the right to make changes without notification to Buyer—to materials or processing that do not affect compliance with any applicable specification.